Wafer-level packaged 3D Piezo MEMS sensor

We are developing a novel 3D piezoMEMS which is an advance piezoelectric MEMS sensor capable of full 3D motion and sensing. This is enabled by depositing AlN on the vertical and horizontal surfaces of a MEMS element, giving the design fully unhindered 3D-motion. Apart from that, we will employ solid-liquid-interdiffusion (SLID) bonding to demonstrate wafer-level packaging providing both hermetic encapsulation as well as electrical interconnections.

SLID is a low-cost, low-temperature and wafer-level bonding technology where EILB group has been involved in the development over the past several years. The key benefit of SLID is to enable heterogeneous integration of different functionality chips together in a single package with the major advantage of lower bonding temperature (down to 150 °C). Our target is to merge two meticulously developed technological platforms within the EILB group – 3D piezoMEMS and SLID to test and demonstrate new capabilities in different MEMS applications, such as, inertial, RF-MEMS switches, in-plane sensors, and actuators.